aROK 8110

Two 260-pin DDR4 SO-DIMM sockets

Up to 32GB+32GB in size, 2400/2666 MHz

4 x 2.5” SATA 3.0 SSD/HDD (15mm height), 3 x 2.5” SATA 3.0 SSD/HDD + 2 x M.2 Key M 2242/2260/2280 SSD (PCIe 3.0 x2), or 3 x 2.5” SATA 3.0 SSD/HDD + 1 x U.2 NVMe SSD (PCIe 3.0 x2/SATA 3.0)

1 x CFast (externally accessible)

1 x Full size mPCIe socket (PCIe 3.0 + USB 2.0)

1 x Full size mPCIe socket (USB 2.0), BOM optional M.2 Key B 3042 (USB 2.0) with 1 x external, 1 x internal SIM

1 x Key B 3042/3050/3052 M.2 socket (USB 3.1 Gen2 + USB 2.0) for LTE/5G NR modem with 1 x external, 1 x internal SIM

1 x PCIe 3.0 x16 slot for discrete graphics card, up to 321mm in length

3 x PCIe 3.0 x4 slot, up to 240mm in length

1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/Beidou

Optional modules with dead reckoning available

Built-in G-sensor

2-Port independent GbE LAN, M12 X-coded

9K byte jumbo frame

PTP (IEEE 1588) support

Controller: Intel® i210-T1, PHY: Intel® I219LMvPro (iAMT) & WOL support

Waterproof DC input connector with ignition for 24/36 VDC-IN

Power buttonReset button

6 x LED indicators for power/IGN/WLAN/WWAN/LAN status

4 x LED indicators for storage/fan control

5 x LED indicators for user to program

1 x USB 3.1 Gen

2 + 1 x USB 2.0, type A

1 x DB15 (CAN/DIO, 4 x DI/4 x DO + 1 x CAN 2.0B)

1 x DB15 (EXT.), reserved for expansion (or DB9 for DR signal)

7 x SMA antenna holes

2 x DB9 (COM3/COM4) for RS232/RS422/RS485 selectable (isolation)

2 x USB 3.1 Gen2, type A

1 x M12 A-coded connector for 2 x USB 2.0

2 x GbE (M12 X-coded)

1 x VGA + 1 x HDMI

2 x DB9 (COM1/COM2) for RS232/RS422/RS485 selectable (isolation)

2 x SIM slots

1 x SMA antenna hole for GNSS

6 x SMA antenna holes

1 x PCIe x16 lane slot

3 x PCIe x4 lane slots

1 x DB9 (AUDIO, female) for 1 x Mic-in (stereo), 2 x Line-out (stereo)

1 x VGA port, up to 1920 x 1200@60Hz

1 x HDMI v1.4, up to 4096 x 2160@30Hz

4-Bit input
- Source: 9~48V-IN (12V@1.1mA/24V@2.2mA)
- External: 0~33VDC pull-high, high-level, 3.3 - 33 VDC; low-level, 0-2 VDC4-Bit output
- Source: 9~48V-IN (nominal 35mA@24V)
- External: 5~27VDC pull-high, sink current w/ 220mA for each bit, 500mA max (@25C)

Source or external can be selected by software (default: source type)

1 x CPU fan

1 x System fan

CAN 2.0B (isolation)

Controller: SJA1000

Bit rate up to 1Mbit/s

Socket CAN supported

11-bit & 29-bit identifiers, ISO 11898-1, ISO 11898-2

ESD: ± 8KV/15KV (contact/air)

2.5KV isolated

24/36 VDC-INC

ranking voltage: 6V~9V (< 30 seconds)

Reverse protection, OCP & UVP

Ignition on/off control/programmable on/off delay timer

Operating temperatures
- EN 50155, class OT4 -40~70°C, 85°C for 10 minutes (w/ 35W TDP CPU, industrial SSD) with air flow

Storage temperatures: -40°C~85°C

Relative humidity: 10%~95% (non-condensing)

IEC 60068-2-64
- 1.0g@5~500Hz (in operating, HDD), 1.6g for HDD w/ damping brackets
- 2.0g@5~500Hz (in operating, SSD + graphics card)MIL-STD-810G (SSD + graphics card)
- Operating: MIL-STD-810G, 514.6C, category 4
- Storage: MIL-STD-810G, 514.6, category 24, minimum integrity test

Shock (SSD + graphics card)
- Operating: MIL-STD-810G, Method 516.6, procedure I, functional shock=40g
- Non-operating: MIL-STD-810G, Method 516.6, procedure V, crash hazard shock test=75g