aROK 5510

Chipset Intel® UHD graphics 630

1 x HDMI 1.4b up to 4096 x 2160 @ 30Hz

1 x VGA up to 1920 x 1200 @ 60Hz

6 x 2.5” SATA external SSD (compatible with 9.5mm drive)

1 x mSATA

1 x M.2 Key M 2280/2242/2260 for SATA 3.0 or PCle 3.0 x4 NVMe 1.31 x Removable SD 3.0

1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0)

1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0), BOM optional full size mini-PCIe socket (USB 2.0) with 2 x external SIM

1 x Full size mini-PCIe socket (USB 2.0) with 2 x external SIM, BOM optional M.2 Key B 3042/3050/3052 (USB 2.0+USB 3.1 Gen1/PCIe 3.0 (BOM optional)+PCIe 3.0 (BOM optional)) with 2 x external SIM

3 x M.2 Key B 3042/3050/3052 (USB 2.0, USB 3.1 Gen 2) with 2 x external SIM

1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/Beidou

Optional M8U/M8L modules with dead reckoning available

G Sensor (3-axis, 10-bit resolution)

2-Port LAN M12 X-coded, 10/100/1000 Mbps Intel® I210/I219 (support iAMT) GbE2-Port LAN 10GbE SFP+ (optional)

4-Port LAN M12 X-coded, 10/100/1000 Mbps, PoE 802.3af/at, max. 60W (optional)

12 x LED indicators (including 2 x programmable LED)

1 x HDMI 1.4b

1 x VGA

1 x M12 A-coded connector for 2 x USB2.0

3 x USB 3.1 Gen 2 type A (5V/1A)

1 x USB 3.1 Gen 1 type A (5V/1A)

8 x Externally accessible SIM card sockets with cover

6 x 2.5” removable SSD tray (with locker)

1 x SD with cover

1 x Reset button

1 x Power button

20 x SMA antenna

2 x LAN M12 X-coded, Intel® I210/I219 (support iAMT) 10/100/1000 Mbps

1 x DB9 (AUDIO) for 1 x Mic-in, 2 x Line-out

2 x DB9 (COM1/COM2) for full RS232 (isolation)

2 x DB9 (COM3/COM4) for full RS232/422/485 (isolation)

1 x DB15 (CAN/DIO)
- 1 x Isolated CANBus 2.0B
- 4 x DI and 4 x DO (isolation)
- Power in for DIO isolation, 9~48VDC

1 x Waterproof DC input connector with the ignition
- 24VDC input with 2.5KVDC isolation
- 110VDC input with 2.5KVDC isolation

Power input 24VDC/110VDC w/ isolationSelectable boot-up & shut-down voltage for low power protection by software

Setting 8-level power on/off delay time by software

Support S3/S4 suspend mode0~255 seconds WDT support, setup by software

SDK (Windows/Linux) including utility and sample code

Operating temperatures: EN 50155, class OT4 (-40~70°C), 85°C for 10 minutes (w/ 35W TDP CPU, 100W TDP GPU, industrial SSD) with airflow

Storage temperatures: -40°C~80°C

Relative humidity: 90% (non-condensing)

Vibration (random)
- 2g@5~500 Hz (in operation, SSD)

Vibration (SSD)
- Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure
- Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity testShock (SSD)
- Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g
- Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g